The core of Semprius technology is micro-transfer printing. This patented process enables the parallel transfer of many pre-formed circuit elements from a source semiconductor wafer to almost any other substrate.
The Process
- Devices and circuits elements are created using standard semiconductor processes
- The circuit elements are defined and released from the source wafer using etch chemistry - no dicing needed
- A compliant transfer stamp removes only the desired elements from the source wafer
- The elements are printed onto a destination substrate
- The stamp returns to the source, increments one die over and repeats the process
Benefits
- Massively parallel printing - up to 1000s of elements printed simultaneously
- High yield - greater than 99% printing yield for most semiconductors
- Low cost - low capital cost, high throughput
- High performance - printed elements maintain performance of host semiconductor
- Separates device formation and target substrate - no temperature limitations
- Wide range of semiconductors - Si, α-Si, GaAs, GaN, InP, diamond
| Proprietary Stamp | |
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| Die picked from source wafer | Die placed on destination substrate |